Process Capability

Beta Electronics strategy of utilizing robust and reliable automated manufacturing platforms have been proven to offer our clients a cost effective and dependable production capability.

Surface Mount Assembly (SMT)

Placement capacity of approx 60,000 cph ( components per hour ) over a dual line configuration utilizing OEM FUJI CP642 and FIP III placement machines controlled via Flexa operational platform.

Component size from 0402 chip - 74 mm Sq QFP including uBGA with BGA Ball inspection.

Inspection

2D Solder paste inspection along with inline AOI    (Automatic Optical Inspection ) via Cyberoptics verifying component placement accuracy and integrity.

Solder Application

Using DEK 265GSX screen printers solder application is proven to be reliable and repeatable.

Wave Solder / Convection re-flow

The use of mutli zone convection re-flow ovens ( Vitronics / Conceptronics ) along with Electrovert wave solder machines establish joint reliability.

Rohs

All processes are both Rohs compliant and Non-Rohs tolerant.