Beta Electronics strategy of utilizing robust and reliable automated manufacturing platforms have been proven to offer our clients a cost effective and dependable production capability.

Surface Mount Assembly (SMT)

Placement capacity of approx 60,000 cph ( components per hour ) over a dual line configuration utilizing OEM FUJI CP642 and FIP III placement machines controlled via Flexa operational platform.

Component size from 0201 chip – 74 mm Sq QFP including uBGA with BGA Ball inspection.


2D Solder paste inspection.

Inline AOI    (Automatic Optical Inspection ) via Cyberoptics verifying component placement accuracy and integrity.

Live X-Ray analysis

Solder Application

Using DEK 265GSX screen printers solder application is proven to be reliable and repeatable.

Wave Solder / Convection re-flow

The use of mutli zone convection re-flow ovens ( Vitronics / Conceptronics ) along with Electrovert wave solder machines establish joint reliability.


Boundary scan via J-TAG interface.

Automated optical inspection (structural test).

Full functional test.

Electrical safety test to comply with LVD and UL requirments.


Semi automated BGA , QFN and uBGA rework capability (Conceptronic Freedom 2000).


All processes are both Rohs compliant and Non-Rohs tolerant.

Fuji CP642
Fuji IP3
Cyberoptics KS100
Dek 265GSX Printer

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