Beta Electronics strategy of utilizing robust and reliable automated manufacturing platforms have been proven to offer our clients a cost effective and dependable production capability.
Surface Mount Assembly (SMT)
Placement capacity of approx 60,000 cph ( components per hour ) over a dual line configuration utilizing OEM FUJI CP642 and FIP III placement machines controlled via Flexa operational platform.
Component size from 0201 chip – 74 mm Sq QFP including uBGA with BGA Ball inspection.
2D Solder paste inspection.
Inline AOI (Automatic Optical Inspection ) via Cyberoptics verifying component placement accuracy and integrity.
Live X-Ray analysis
Using DEK 265GSX screen printers solder application is proven to be reliable and repeatable.
Wave Solder / Convection re-flow
The use of mutli zone convection re-flow ovens ( Vitronics / Conceptronics ) along with Electrovert wave solder machines establish joint reliability.
Boundary scan via J-TAG interface.
Automated optical inspection (structural test).
Full functional test.
Electrical safety test to comply with LVD and UL requirments.
Semi automated BGA , QFN and uBGA rework capability (Conceptronic Freedom 2000).
All processes are both Rohs compliant and Non-Rohs tolerant.